The Electrical & Microsystems Modeling Department develops and markets application software that support engineering processes and provide a 3D vision of systems at both the conceptual and material level. Providing both large scale computing solutions and customized modeling and simulation tools, our tools can encourage the efficiency of greater missions.

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June 26, 2006 - FAETHM Patent

Congratuations to the FAETHM Team for receiving US Patent No. 7,065,736!

June 15, 2006 - Xyce News Note

• New Xyce capability demonstrated: integrated electro-mechanical system simulation

• Release Notes
• Users' Guide
• Reference Guide

  For more information, please visit the official Xyce website.

Xyce team and collaborators were nominated for “Best Paper” in the highly competitive IEEE Transactions on Computer Aided Design of Integrated Circuits and Systems journal: “Title: Robust, Stable Time-Domain Methods for Solving MPDEs of Fast/Slow Systems Authors: Ting Mei, Jaijeet Roychowdhury, Todd S. Coffey, Scott A. Hutchinson, David M. Day”.

• "Three computer programs mark major progress by 9200 (now 1400) staff developing agile microsystems design tools and high-fidelity process simulators. Two codes provide a breakthrough, automated design loop for MEMS (made using standard microelectronics masking and deposition techniques). The unique program FAETHM generates a mask set from a 3-D part design...ChISELS, a 3-D massively parallel code, accurately models key microsystem fabrication processes such as plasma enhanced chemical vapor deposition and deep reactive ion etching. (9200)"

  Download Sandia Lab News: Lab Accomplishments 2005 (.pdf)